Stealth Dicing™ Process vs. Ordinary Dicing Methods

Differences between Stealth Dicing™ Process and ordinary blade dicing and laser dicing are summarized below.

Stealth Dicing vs. Ordinary Dicing Methods

  • Blade dicing
    In blade dicing the wafer is cut while pressing it against a diamond plate wheel (blade) rotating at high speed. This is a contact method and therefore generates physical stress on the material and causes chipping on the front and back side surfaces. The cutting creates a large amount of heat duet to contact friction, so cooling water is required. The waste water from the cutting must also be disposed of.
  • Laser ablation (ordinary laser dicing)
    Laser ablation works by carving a groove hole while melting/vaporizing the wafer surface layers away using a laser beam at a wavelength that causes the material to absorb it. The melting/vaporizing from the laser ablation causes thermal damage at the edge of the machined material and also emits debris (grit) so that protective layers must first be formed in advance from resist to prevent contamination and a washing process is required. This means supplemental processes such as for post-washing and removal are needed.
  • Stealth Dicing™ Process
    In Stealth Dicing™ Process, a laser beam at a wavelength that transmits through the material is focused on an internal section of the wafer to selectively form layers called "SD layers" that serve as start points for wafer separation. Applying an external force by methods such as a tape expander causes cracks to extend from the SD layer and develop towards the front and back side surfaces. The laser light transmits through the wafer and so causes no heat damage to the wafer surface. Moreover, the chip yield from a single wafer is extremely high because there is no cutting loss material. Stealth DicingTM Process does not have the problems caused by ordinary dicing methods such as contamination from melting debris. Stealth DicingTM Process is a completely dry process needing no washing water.
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