Papers for Journals and Academic Conferences

Papers for journals

  • E. Ohmura et al., "Internal modified-layer formation mechanism into silicon with nanosecond laser", Journal of Achievements in Materials and Manufacturing Engineering 17, 381(2006).
  • M. Kumagai et al., "Advanced Dicing Technology for Semiconductor Wafer - Stealth Dicing", IEEE Transactions on Semiconductor Manufactureing 20, 259(2007).
  • E. Ohmura et al., "Analysis of Processing Mechanism in Stealth Dicing for Ultra Thin Silicon Wafer", Journal of Advanced Mechanical System Design, Systems, and Manufacturing 2(4), 540(2008).

International Conferences

  • F. Fukuyo et al., "Stealth Dicing Technology and Applications", Proceedings of the 6th Symp. on Laser Precision Microfabrication(LPM2005), (2005).
  • K. Fukumitsu et al., "The Mechanism of Semiconductor Wafer Dicing by Stealth Dicing Technology", Proceedings of the 4th International Congress on Laser Advanced Materials Processing(LAMP2006), (2006).
  • T. Monodane et al., "Thermo-Elastic-Plastic Analysis on Internal Processing Phenomena of Single-Crystal Silicon by Nanosecond Laser", Proceedings of the 4th International Congress on Laser Advanced Materials Processing(LAMP2006), (2006).
  • M. Kumagai et al., "Advanced dicing technology for semiconductor wafer -Stalth Dicing-", The 13th International Symposiumu on Semiconductor Manufacturing(ISSM 2006) Conference Proceedings, 215(2006).
  • Ohumura et al., "Internal Modification of Ultra Thin Silicon Wafer by Permeable Pulse Laser", Proceedings of The 8th International Symposium on Laser Precision Microfabriction (LAMP207), (2007).
  • M. Kumagai et al., "Laser processing of doped silicon wafer by the Stealth Dicing", Proceedings of 2007 International Symposium on Semiconductor Manufacturing (ISSM2007), 521(2007).
  • Ohumura et al., "Laser processing of doped silicon wafer by the Stealth Dicing", Proceedings of The 4th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), (2007).

Conference Publications (published in Japanese)

  • Ryuji Sugiura, et al., "Stealth dicing and its applications", Proceedings of the 63rd Laser Material Processing Conference, 115 (2005).

Others (published in Japanese)

  • Hidetsugu Takaoka, "Principle and features of stealth dicing technology ideal for ultra-thin semiconductor wafer dicing", Denshi Zairyo (Electronic Materials), Sept. 2002, 17 (2002).
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